SiP Conference China 2020

On behalf of the Program Committee and Executive Committee, it is my pleasure to invite you to the 4th annual SiP China Conference, which will be held at Shenzhen International Exhibition Center (Baoan, Shenzhen, China) from September 9-10, 2020.

The conference and exhibition will highlight System in Package (SiP) technologies that are helping to implement cost effective and size reduction solutions for 5G NR cellular and base stations, IoT, automated smart cities, autonomous and connected vehicles, Artificial Intelligent (AI), data storage, computing and networking.

The SiP Conference China is widely regarded as the most prominent SiP conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.

Last year, the 2019 conference attracted more than 90 companies from China, United States, France, Italy, Japan, Korea, India and Malaysia with 276 industry leaders and experts gathered to give their thought leadership and connect with each other. We welcomed 26 speakers, 21 exhibitors and 23 media and press partners.

SiP Conference China 2020 will feature a full day of keynote speeches covering SiP market, SiP technology and SiP business trends from OSATs, system houses, research and development industries and academic leaders on the first day of the conference. Two separate tracks will be covered during the second day of the conference.

Track 1: SiP Design, Assembly and Test

Track 2: Advancement in SiP assembly process, materials and substrates

Additionally, the conference offers attendees numerous opportunities for networking and discussion with colleagues during coffee breaks, daily luncheons and nightly receptions.

We look forward to having you join us in September for this important event.

Nozad Karim
General Chair of SiP Conference China 2020
VP, Amkor Technology









The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

SiP Business and Technology Trends

SiP System Solutions for Smartphone and IoT

5G NR & mmWave SiP Solutions

2.5D/3D and WLSiP Applications, Assembly and Test Challenges

Advance Material & Substrate Solutions for SiP

provide dynamic learning and technology updates for SiP related trends

The guest team


Design, planning, planning, project management and other high-end talent system

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