Nozad Karim presently is the Vice President of SiP & System Integration at Amkor Technology. He has over 20 years’ experience with SiP & module technology developments, and over 30 years of experience working with semiconductor packaging, circuit and system designs for digital, analog, and RF/Microwave applications. Prior to Amkor, he served in engineering and management roles with Motorola Communication, Texas Instruments, & Compaq Computer.
With over 25+ years experience in electronics process engineering, material science and technology strategic planning, David is leading innovative assembly technology development for high volume manufacturing operation of consumer electronics, including smartphones, smartwatches, SiP modules, automotive modules, tablets, PC, etc. David has spent many years on Design for Manufacturing (DFM), developed DFX design guidelines, wrote assembly process specifications & standards, established NPI (New Product Introduction) verification facilities and audited EMS outsourcing. Prior to Huawei, David also held a several senior and principal technical positions in Nokia Mobile Phones, Nortel Networks and Alcatel. David is also holding several technology patents in US, Europe and China, leading industrial consortium and external technology collaboration and actively providing keynote presentations and speeches in conferences, seminar and training courses with international background and East-meets-West culture & multi-language capabilities.
Rozalia Beica is currently Global Director Strategic Marketing with DowDuPont. She is focusing on strategic activities, identifying new technologies and markets, growth opportunities across Electronics & Imaging Division. She has 25 years of international working experience across various industries, including industrial, electronics and semiconductors. For 18 years she was involved in the research, applications and strategic marketing of Advanced Packaging, with global leading responsibilities at specialty chemicals (Rohm and Haas), equipment (Semitool, Applied Materials and Lam Research) and device manufacturing (Maxim IC). Prior to joining Dow, Rozalia was the CTO of Yole Developpement where she led the market research, technology and strategy consulting activities for Advanced Packaging and Semiconductor Manufacturing.
Rahul Manepalli is a Sr. Principal Engineer and the Director of Module Engineering in Substrate and Package Technology Development Group in Intel Corporation. Rahul manages the Module Engineering group responsible for development of next generation Substrate and Package Technologies for all of Intel’s packaging needs. He has over 20 years of experience in Packaging (Assembly & Substrate materials, processes and modules) and has lead the startup and development of multiple Intel factories and Technology Development teams. He holds over 40 + worldwide patents in the area of electronic packaging and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Feng Ling (S’97-M’00-SM’07) is currently Founder and CEO of Xpeedic Technology, Inc., a leading EDA software and IP provider in chip-package-system solution. In 2000, he was a Senior Staff Engineer/Scientist at Motorola (now Freescale Semiconductor), working on RF module technology with LTCC and HDI substrate. In 2002, he joined Neolinear, where he led the electromagnetic solver development for mixed-signal RF integrated circuit designs. Through Cadence acquisition of Neolinear, he joined Cadence in 2004. As VP of Engineering, he co-founded Physware in 2007 (acquired by Mentor Graphics in 2014). In 2010, he founded Xpeedic Technology, Inc., continuing the efforts to bring the novel solution to the RF design and high speed digital community. Dr. Ling received his Ph.D. degree in electrical engineering from the University of Illinois at Urbana-Champaign (UIUC) in 2000. He is a Senior Member of IEEE. He has authored and co-authored 2 book chapters and more than 60 papers in refereed journals and conference proceedings. He has served on the technical program committee of DesignCon, EDAPS, and EPTC. He has 5 US patents. He was the inaugural recipient of the Y. T. Lo Outstanding Research Award from the Department of Electrical and Computer Engineering at UIUC in 1999. He has been an Affiliate Associate Professor in the Department of Electrical Engineering at the University of Washington, Seattle, WA from 2007 to 2011.
Jingkun Mao received his B.S. and M.S. degrees in Electrical Engineering from Tsinghua University, Beijing, China, in 1998 and 2000, respectively. He received his Ph.D. degree in Electrical Engineering from the University of Missouri-Rolla in 2004. From 2004 to 2009, he worked for Amkor Technology Inc., Phoenix, AZ, as a RF Packaging Engineer. Then, he joined the Third Research Institute of MPS, as a Director of Engineer. In July 2012, he joined the SRCT Tech. Co. Ltd, currently serves as the vice general manager. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power-bus modeling, intra-system EMI and RF interference, PCB noise reduction,differential signaling, and package designs.
Hansen He is a senior technology service engineer at Henkel Electronics Material based in Shenzhen, He has over 10 years of experience in semiconductor packaging material; he has worked in Henkel for 6 years and co-work with customer for material innovation and upgrade, he is responsible for semiconductor and sensor packaging material, including die attach, EMI, underfill and encapsulant;
Charlie is a product engineering architect in Cadence System Analysis BU (business unit). He has more than 25 years’ experience on EDA industry and semiconductor design and analysis. He has joined Cadence since 2004 as an IC package design consultant to assist multiple IC design companies in Asia Pacific region to build up in-house design and analysis capability. He is a Cadence’s key person to support TSMC’s reference flow on advanced wafer level over than 15 years. He is also an expert on interconnect modeling for an IC design, 2.5D interposer design, 3DIC design, package, board and MCAD. His recent work is on an innovative 3D full-wave solver development. Charlie received the B.S. degree from the Department of Electro-physics and the M.S. degree from the Institute of Electronics Engineering, National Chiao-Tung University, Hsinchu, Taiwan, in 1992 and 1994, respectively.
Hu is based in Suzhou, China, and has extensive experience in semiconductor packaging. He is a veteran in advanced assembly technology development, process improvement, and assembly materials application. He has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. Hu earned a master's degree in IC Engineering from Chinese Academy of Sciences, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
Zhang yanping graduated from Harbin engineering university, CEO and general manager of Shenzhen KED photoelectric technology co., LTD. After graduation from university, Worked as r&d manager and sales manager of shenzhen Rilian technology co., LTD. In 2008, founded shenzhen KED optoelectronics technology co., LTD., successively serving as the company's director, r&d director, general manager and CEO, etc.
• Doctor of Philosophy, Shanghai JiaoTong University • National Information Technology Education Project Expert (Integrated Circuit), Ministry of Industry and Information Technology • Microsystem Guest Chief Expert, China Electronics Technology Group • Former Senior Electronic Engineer Cadence Research and Development Center, Shanghai • Reviewer, IEEE TMTT，IEEE TAP, DAC
Farhang Yazdani is the President and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 20 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He is the author of the book “Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach”. He is the recipient of 2013 NIPSIA award in recognition of his contribution to the advancement and innovations in packaging technologies. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.
Pearl He has 20 years of industry experience in automatic semiconductor testing.She joined NI in 2013, responsible for planning strategy of semiconductor business and leading the business development of semiconductor team.Under her leadership, NI brand's popularity in the semiconductor testing industry in China and Asia Pacific increased rapidly.Over the past 20 years, she has worked as an application engineer and application development manager at the world-renowned semiconductor ATE company, and has also been responsible for engineering and services in China for U.S. start-ups.
Jensen is currently Director of the Corporate R&D for new assembly package & new technology development strategy decision. He has been exploring the strategy for various new assembly technologies. Jensen has also published many papers and patents, majorly for flip chip technologies.
Jun Yang is the package technical expert of vivo. He has over 15 years package development experience including SiP package design，material selection and process assessment. He is in charge of SiP development after join vivo in 2017.