Conference Program
2020.9.19-20
September 19 (Day 1) |
Grand Ballroom |
08:00 - 08:30 |
Registration and Networking |
Session 1 |
iP Business and Technology Trends for 5G Products |
08:30 - 09:00 |
Conference Chair Opening Statement Nozad Karim VP Amkor Technology |
09:00 - 09:30 |
Advanced Packaging for Heterogeneous Integration: Challenges and Opportunities Rahul Manepalli, Sr. Director of Engineering, SPTD & Sr. Principal Engineer, Intel Corporation |
09:30 - 10:00 |
SiP Packaging for Consumer and Medical Device Application Steven Guo, Technical Director, UNISOC |
10:00 - 10:30 |
Coffee Break & Exhibit |
10:30 - 11:00 |
Clarity: Innovative 3D Full-Wave Solver for Advanced Packages Ben Gu, General manager of multi-physics system analysis Business unit, Cadence Design Systems, Inc |
11:00 - 11:30 |
Future 2.5/3D Technologies in AI Era Mitsumasa Koyanagi, Senior Research Fellow, Tohoku University |
11:30 - 12:00 |
Enabling SiP Design with Differentiating Simulation Technologies Dr. Wenliang Dai, VP Engineering, Xpeedic Technology |
12:00 - 02:00 |
Lunch |
Session 2 |
SiP Challenges for Cellphone, loT and Wearables |
02:00 - 02:30 |
RF SiP Packaging Technology Trends, on the way to 5G and mmWave Applications Romain Fraux, CEO, System Plus Consulting |
02:30 - 03:00 |
The Requirements, Challenge and Trend of SiP in Mobile Devices（2.0） Jun Yang, Package Technical Expert, vivo |
03:00 - 03:30 |
Coffee Break & Exhibit |
Session 3 |
Advancement in 5G Material & Packaging Solutions |
03:30 - 04:00 |
Challenges and Opportunities for Silicon Photonic Integration Technology Prof. Minghua Chen, Tsinghua University |
04:00 - 04:30 |
Novel Water Soluble Fluxes Study for Heterogeneous Integration Assembly Leo Hu, Semiconductor Technology Manager, Indium Corporation |
04:30 - 05:00 |
Challenge and Solution of New Package Cleaning Jason zhang, CEO, Guangdong KED Cleaning Technology Co., Ltd. |
05:00 - 07:00 |
Exhibit Hall Reception |
September 20 (Day 2) |
Grand Ballroom A |
08:30 - 09:00 |
Registration and Networking |
Session 4 |
SiP Challenges for Cellphone, loT and Wearables |
09:00 - 09:40 |
Material Challenges and Solutions for System-in-Package Applications Ramachandran “Ram” K. Trichur, Global head of Advanced Semiconductor Packaging Market Segment, Henkel Adhesive Technologies – Electronics |
09:40 - 10:10 |
SiP Material Systems for 5G and Automotive Applications Tim Lu, Segment Marketing Manager, Heraeus GmbH & Co. KG |
10:10 - 11:00 |
Coffee Break & Exhibit |
11:00 - 11:30 |
Package Application & Challenge for 5G Era Jensen Tsai, Director of Corporate R&D, SPIL |
11:30 - 12:00 |
Application of Multi-package Platform in SiP Jianyou Xie, Chief Scientist of Tongfu Research Institute, TongFu Microelectronics Co., Ltd. |
12:00 - 02:00 |
Lunch |
Session 5 |
SiP Design Challenges |
02:00 - 02:30 |
Packaging Solutions for AI/HPC and 5G Megatrend Farhang Yazdani, President & CEO, BroadPak Corporation |
02:30 - 03:00 |
Packaging Design Challenges and Solutions for 5G Products Polin Chi, Advanced Packaging Product Manager Asia, Mentor, a Siemens Business |
03:00 - 03:30 |
Coffee Break & Exhibit |
03:30 - 04:00 |
Goertek's SIP solution: Adavanced Packaging Technology Public Service Platform - turning your idea into reality Rico Tian, Technical Director, Goertek |
04:00 - 04:30 |
3D-SiP Package Based-on Fan-out WLP Technology Lewis (In-Soo) Kang, Managing Director, nepes Corporation |
04:30 - 05:00 |
Conference Chair Closing Statement Nozad Karim, Vice President, System in Package, Amkor Technology, Inc. |
September 20 (Day 2) |
Grand Ballroom B |
08:30 - 09:00 |
Registration and Networking |
Session 6 |
Advencements in SiP Test Solutions |
09:00 - 09:30 |
Recent Advances in Underfill for SiP OSAMU SUZUKI, Group Manager, Namics Corporation |
09:30 - 10:10 |
Discovering New Intermediate Testing for SiP Based on Platform Based Approach Pearl He, APAC Semiconductor Business Development Manager, National Instruments |
10:10 - 11:00 |
Coffee Break & Exhibit |
11:00 - 11:30 |
SiP Defluxing & Underfill Solutions Namkyu Kim, Sales Manager, ZESTRON |
11:30 - 12:00 |
Progress and Applications of Embedded System in Chip (eSinC®) Technology Dr. Shuying Ma, Manager of TSV Depart, Huatian Technology (Kunshan) Electronics Co. Ltd. |
12:00 - 02:00 |
Lunch |
Session 7 |
SiP Substrate & Packaging Technology |
02:00 - 02:30 |
Advanced Insulating Materials for Semiconductor Package Hirohisa Narahashi, Group Manager, Ajinomoto CO., INC |
02:30 - 03:00 |
All in One Package - Solution to Integration and Miniaturization Artan Baftiri, R&D Project Leader, AT & S Austria Technologie & Systemtechnik AG |
03:00 - 03:30 |
Coffee Break & Exhibit |
03:30 - 04:00 |
Goertek's SIP solution: Adavanced Packaging Technology Public Service Platform - turning your idea into reality Rico Tian, Technical Director, Goertek |
04:00 - 04:30 |
3D-SiP Package Based-on Fan-out WLP Technology Lewis (In-Soo) Kang, Managing Director, nepes Corporation |
04:30 - 05:00 |
Conference Chair Closing Statement Nozad Karim, Vice President, System in Package, Amkor Technology, Inc. |