Advancements in System-in-Package (SiP) packaging landscape during the past few years have brought many new solutions and techniques along with sophisticated system integration methodologies for better electrical, mechanical and thermal performances. The advancement in SiP assembly, test and material forms the heart and soul of the new generation of SiP platforms.

This conference and the exhibition will highlight new advancement in SiP technologies that are helping to implement size reduced and cost-effective solutions for high data rate wireless 5G technology to cover a wide spectrum of application such as 5G-NR cellular, IoT, autonomous vehicles, Artificial Intelligent (AI), data storage, computing and networking.

SiP Conference China 2021 will feature two days of keynote speeches and technical presenters covering SiP technology and business trends from OSATs, test providers, material suppliers, system houses, research and development industries. Given the current global COVID-19 consideration, a few of the keynotes and the presentations will be conducted virtually either through live or recorded Webinars

The SiP Conference China is widely regarded as the most prominent SiP conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.

On behalf of the Program Committee and Executive Committee, it is my pleasure to invite you to the 5th annual SiP China Conference, which will be held in Shenzhen International Exhibition Center (Baoan, Shenzhen, China) from September 28-29, 2021.

Additionally, the conference will offer attendees numerous opportunities for networking and discussion with colleagues during coffee breaks, daily luncheons and nightly receptions.

We look forward to having you join us in September for this important event.

Nozad Karim

General Chair of SiP Conference China 2021

VP. Amkor Technology









The conference will cover the following vital topics

key topic

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.

● Keynote

● SiP Assembly & Test

● SiP Design Solutions

● SiP System Solutions

● SiP Heterogeneous Integration

● SiP Substrate Solutions

● Bumping/WLCSP

● Advanced in SiP Material and interconnect Technology

● Test & Design Solutions

● Advancement in Assembly SiP Equipment

● Advanced in SiP Material and interconnect Technology

● Design Automation Tools

Conference Executive Team


General Chair:

Nozad Karim
 VP, SiP
Product Line
 Amkor Technology

Executive Chair:

Rozalia Beica
AT&S (China) Co., Ltd.
Head of Semiconductor
Business Line

Technical Chairs & Session Leaders:

David Lu
Former VP, New Technology
Research Institute vivo Mobile
Communication Co., Ltd.

Rahul Manepalli
Sr. Director of Engineering,
SPTD & Sr. Principal Engineer,
Intel Corporation

Feng Ling
Founder and CEO,
Co., Ltd.

Suny Li
SiP Tech

Prof. Sun Rong
PHD Supervisor, Dean of
Shenzhen Institute of Advanced
Electronic Materials (SIEM)

S. W. Ricky Lee
Acting Dean,
Systems Hub, HKUST(GZ),

Rainbow Yuan
Director 3C
Business Line,

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