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Overall Introduction

WELCOME FROM THE 3rd SiP CONFERENCE CHINA 2019 GENERAL CHAIR

General Chair:
Nozad Karim

VP; System in Package at Amkor Technology, Inc.

Thank you for attending and supporting the SiP Conference China 2018 in Shanghai. The 2018 conference had 257 attendees and distinguished guests from China, North America, Europe, Japan, South Korea and other countries. In addition, 18 professional media outlets took part in interviewing and reporting on the event.

It is my great pleasure to invite you to the SiP Conference China 2019 to be held in Shenzhen, China. The conference will be held September 5-6, 2019 at The Westin Shenzhen Nanshan Hotel (9028-2 Shennan Road, Nanshan District, Shenzhen 518053 China). This conference is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.

The arrival of 5G and Artificial intelligent (AI) technology is having a massive impact on wireless, IoT, autonomous and connected vehicles, automated smart cities, base stations, data storage, computing and networking. The conference and exhibition will highlight System in Package technologies that are helping to implement cost effective solutions of electronic components integration in small size SiP packaging. The program will include several keynote speakers and technical sessions, followed by a panel discussion of key issues, including SiP assembly and test, advancement in materials and substrates and system solutions for targeted market applications.

Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps. The conference will cover the following vital topics:

● SiP Business and Technology Trends
● SiP System Solutions for Smartphone and IoT
● 5G NR & mmWave SiP Solutions
● 2.5D/3D and WLSiP Applications, Assembly and Test Challenges
● Advance Material & Substrate Solutions for SiP

The SiP conference China 2019 will provide dynamic learning and technology updates for SiP related trends.

Please feel free to contact Irene Zhou (irene.zhou@ubm.com) if you are interested in participating as a speaker or exhibitor at the event.


Nozad Karim
General Chair of SiP Conference China 2019
VP; System in Package at Amkor Technology