On behalf of the Program Committee and Executive Committee, it is my pleasure to invite you to the 4th annual SiP China Conference, which will be held at Shenzhen International Exhibition Center (Baoan, Shenzhen, China) from September 9-10, 2020.
The conference and exhibition will highlight System in Package (SiP) technologies that are helping to implement cost effective and size reduction solutions for 5G NR cellular and base stations, IoT, automated smart cities, autonomous and connected vehicles, Artificial Intelligent (AI), data storage, computing and networking.
The SiP Conference China is widely regarded as the most prominent SiP conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise from all aspects of the design and supply chain, including assembly and test from OSATs, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries as well as material and equipment suppliers.
Last year, the 2019 conference attracted more than 90 companies from China, United States, France, Italy, Japan, Korea, India and Malaysia with 276 industry leaders and experts gathered to give their thought leadership and connect with each other. We welcomed 26 speakers, 21 exhibitors and 23 media and press partners.
SiP Conference China 2020 will feature a full day of keynote speeches covering SiP market, SiP technology and SiP business trends from OSATs, system houses, research and development industries and academic leaders on the first day of the conference. Two separate tracks will be covered during the second day of the conference.
Track 1: SiP Design, Assembly and Test
Track 2: Advancement in SiP assembly process, materials and substrates
Additionally, the conference offers attendees numerous opportunities for networking and discussion with colleagues during coffee breaks, daily luncheons and nightly receptions.
We look forward to having you join us in September for this important event.
Nozad Karim
General Chair of SiP Conference China 2020
VP, Amkor Technology
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Presentations from inspiring speakers will address innovative ideas, approaches, the latest R&D progress and roadmaps.
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Design, planning, planning, project management and other high-end talent system
Nozad Karim presently is the Vice President of SiP & System Integration at Amkor Technology. He has over 20 years’ experience with SiP & module technology developments, and over 30 years of experience working with semiconductor packaging, circuit and system designs for digital, analog, and RF/Microwave applications...
Rozalia Beica is currently Global Director Strategic Marketing with DowDuPont. She is focusing on strategic activities, identifying new technologies and markets, growth opportunities across Electronics & Imaging Division. She has 25 years of international working experience across various industries, including industrial...
Rahul Manepalli is a Sr. Principal Engineer and the Director of Module Engineering in Substrate and Package Technology Development Group in Intel Corporation. Rahul manages the Module Engineering group responsible for development of next generation Substrate and Package Technologies for all of Intel’s packaging needs...
Feng Ling is currently Founder and CEO of Xpeedic Technology, a leading EDA solution provider for chip-package-system designs. Dr. Ling has twenty years’ experience in EDA, RF front end and system-in-package designs. His industrial career spans from corporate like Bell Labs and Motorola to EDA startup Neolinear (acquired by Cadence) and Physware (acquired by Mentor Graphics)...
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer...
Farhang Yazdani is the President and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 20 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide...
Steven joined spreadtrum communications (Shanghai) co., LTD. (now-unisoc) in July 2012 and he is the leader of the Codesign Team of chip packaging. Steven has 17 years of working experience in chip design and semiconductor industry, and is the earliest technical expert engaged in cross-platform collaborative design and simulation analysis in China...